• DocumentCode
    2401332
  • Title

    Simulation of thermal effects in electrical systems

  • Author

    Vogelsong, Ronald S. ; Brzezinski, Chris

  • Author_Institution
    Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
  • fYear
    1989
  • fDate
    13-17 Mar 1989
  • Firstpage
    353
  • Lastpage
    356
  • Abstract
    Simulators based on the SPI CE program have one major limitation in that every device in a system must operate at the same temperature. A discussion is presented of modifications implemented in SPICE such that each device´s operating temperature can be set independently by operating-point power dissipation and/or user input, and can vary during a transient analysis controlled by a user-defined parallel thermal network. The method used to describe the thermal system is an electrical analog. The temperature is characterized as voltage and the power as current. The thermal resistances and capacitances are represented with resistors and capacitors. The thermal network is then solved simultaneously with the electrical network using the same algorithms
  • Keywords
    digital simulation; electronic engineering computing; network analysis; SPI CE program; capacitors; parallel thermal network; power dissipation; resistors; simulation; simulators; thermal capacitances; thermal effects; thermal resistances; transient analysis; Capacitance; Circuit simulation; Computational modeling; Power system modeling; Power system simulation; Resistors; SPICE; Temperature; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition, 1989. APEC' 89. Conference Proceedings 1989., Fourth Annual IEEE
  • Conference_Location
    Baltimore, MD
  • Type

    conf

  • DOI
    10.1109/APEC.1989.36986
  • Filename
    36986