DocumentCode
2401332
Title
Simulation of thermal effects in electrical systems
Author
Vogelsong, Ronald S. ; Brzezinski, Chris
Author_Institution
Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
fYear
1989
fDate
13-17 Mar 1989
Firstpage
353
Lastpage
356
Abstract
Simulators based on the SPI CE program have one major limitation in that every device in a system must operate at the same temperature. A discussion is presented of modifications implemented in SPICE such that each device´s operating temperature can be set independently by operating-point power dissipation and/or user input, and can vary during a transient analysis controlled by a user-defined parallel thermal network. The method used to describe the thermal system is an electrical analog. The temperature is characterized as voltage and the power as current. The thermal resistances and capacitances are represented with resistors and capacitors. The thermal network is then solved simultaneously with the electrical network using the same algorithms
Keywords
digital simulation; electronic engineering computing; network analysis; SPI CE program; capacitors; parallel thermal network; power dissipation; resistors; simulation; simulators; thermal capacitances; thermal effects; thermal resistances; transient analysis; Capacitance; Circuit simulation; Computational modeling; Power system modeling; Power system simulation; Resistors; SPICE; Temperature; Thermal resistance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 1989. APEC' 89. Conference Proceedings 1989., Fourth Annual IEEE
Conference_Location
Baltimore, MD
Type
conf
DOI
10.1109/APEC.1989.36986
Filename
36986
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