• DocumentCode
    2402283
  • Title

    Harnessing geographically distributed co-operation in microtechnology course at Massey University

  • Author

    Browne, R. ; Demidenko, S. ; Driscoll, R.O.

  • Author_Institution
    Inst. of Inf. Sci. & Technol., Massey Univ., Palmerston North, New Zealand
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    250
  • Lastpage
    254
  • Abstract
    A good knowledge of the basics and an appreciation of a selection of advanced topics of microelectronic and microsystem technologies are vitally important for engineering graduates who are going to work for leading national and multinational hi-tech companies in New Zealand or overseas. The emphasis in Massey University\´s engineering programs is on the digital domain. However a limited exposure is also provided to analogue and microsystems design methodologies. The taught component of the electronics curriculum culminates in the fourth year module "Advanced Micro Technologies". New Zealand\´s lack of commercial wafer and IC fabrication facilities, as well as very limited pools of VLSI and microsystem design and test companies, specialists and available tools have been resolved by forming linkages with overseas partner universities and companies. Such collaboration has been very promising and has resulted in getting access to advanced design, fabrication and test facilities, as well as to design tools and expertise
  • Keywords
    VLSI; circuit CAD; educational courses; electronic engineering education; integrated circuit design; integrated circuit manufacture; integrated circuit technology; micromachining; micromechanical devices; IC fabrication facilities; Massey University; VLSI design; VLSI test; analogue design methodologies; collaboration; design facilities; digital domain; engineering graduates; geographically distributed co-operation; microelectronic technologies; microsystem design methodologies; microsystem technologies; microtechnology course; overseas partner companies; overseas partner universities; test facilities; university engineering programs; wafer fabrication facilities; Collaborative tools; Couplings; Design methodology; Educational institutions; Fabrication; Integrated circuit testing; Knowledge engineering; Microelectronics; Test facilities; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Design, Test and Applications, 2002. Proceedings. The First IEEE International Workshop on
  • Conference_Location
    Christchurch
  • Print_ISBN
    0-7695-1453-7
  • Type

    conf

  • DOI
    10.1109/DELTA.2002.994624
  • Filename
    994624