• DocumentCode
    2402680
  • Title

    A trade-off method between cost and reliability

  • Author

    Burnett, Robert

  • Author_Institution
    Dept. de Inf., Pontificia Univ. Catolica do Parana, Curitiba, Brazil
  • fYear
    1997
  • fDate
    10-15 Nov 1997
  • Firstpage
    21
  • Lastpage
    28
  • Abstract
    Proposes a method for estimating the development cost of a software module, taking into account the target level of reliability for that module. Our objective is to establish a basis for a model to guide a primary trade-off between cost and reliability during the design phase of the development of a modular software system. The line of argument developed is that the operational reliability of a software module can be linked to the effort spent during the testing phase; a higher level of desired reliability requires more testing effort and, consequently, costs more. A decomposition technique is used to estimate the cost of development, based on an estimate of the number of faults to be found and fixed in the required reliability, using data obtained from the requirement specification and historical data. The proposed model is easy to understand and suitable for use by project managers
  • Keywords
    program testing; project management; software cost estimation; software development management; software reliability; subroutines; cost/reliability trade-off method; decomposition technique; fault estimation; historical data; modular software system design phase; operational reliability; project management; requirement specification; software module development cost estimation; software reliability; software testing phase; target reliability level; Cost function; Phase estimation; Project management; Resource management; Software development management; Software reliability; Software systems; Software testing; System testing; Yield estimation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science Society, 1997. Proceedings., XVII International Conference of the Chilean
  • Conference_Location
    Valparaiso
  • Print_ISBN
    0-8186-8052-0
  • Type

    conf

  • DOI
    10.1109/SCCC.1997.636852
  • Filename
    636852