Title :
Electrical and thermal layout design considerations for integrated power electronics modules
Author :
Chen, Jonah Zhou ; Pang, Ying Feng ; Boroyevich, Dushan ; Scott, Elaine P. ; Thole, Karen A.
Author_Institution :
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Abstract :
A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the electrical analysis, including the parasitic extraction done by the Maxwell Q3D Extractor. A parametric study was conducted to determine the common model EMI noise of several different layouts. The final design layout was achieved after tradeoff between electrical and thermal performance.
Keywords :
DC-DC power convertors; electromagnetic compatibility; electromagnetic interference; integrated circuit layout; power integrated circuits; thermal analysis; 3D geometrical design layout; DC/DC power conversion; Maxwell Q313 Extractor; active integrated power electronics modules; common model EMI noise; electrical layout design considerations; electrical performance; parametric study; thermal layout design considerations; thermal performance; Circuit simulation; Computational modeling; Costs; DC-DC power converters; Electromagnetic interference; Electronic packaging thermal management; Inductance; Parasitic capacitance; Power electronics; Thermal management of electronics;
Conference_Titel :
Industry Applications Conference, 2002. 37th IAS Annual Meeting. Conference Record of the
Conference_Location :
Pittsburgh, PA, USA
Print_ISBN :
0-7803-7420-7
DOI :
10.1109/IAS.2002.1044095
