Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

Author

Jeong, Jaeyong ; Jeong, Jichai

Author_Institution

Dept. of Radio Eng., Korea Univ., Seoul, South Korea

fYear

1998

fDate

26-28 Oct 1998

Firstpage

61

Lastpage

64

Abstract

We report electrical characterization of ball grid array (BGA) packages solely from 1-port S-parameter measurements below 500 MHz. The capacitance, inductance and resistance of transmission lines in the packages are extracted. Extracted capacitances are compared with those from simulations and measurements at low frequency

Keywords

S-parameters; ball grid arrays; capacitance; circuit simulation; electric resistance; inductance; integrated circuit measurement; integrated circuit packaging; BGA packages; S-parameter measurements; ball grid array packages; capacitance; electrical characterization; extracted capacitances; inductance; low frequency measurements; package transmission lines; resistance; simulated capacitances; simulation; single-port S-parameter measurements; Capacitance measurement; Distributed parameter circuits; Electric variables measurement; Electrical resistance measurement; Electronics packaging; Equivalent circuits; Frequency; Inductance; Scattering parameters; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733750

Filename

733750