Title :
Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz
Author :
Jeong, Jaeyong ; Jeong, Jichai
Author_Institution :
Dept. of Radio Eng., Korea Univ., Seoul, South Korea
Abstract :
We report electrical characterization of ball grid array (BGA) packages solely from 1-port S-parameter measurements below 500 MHz. The capacitance, inductance and resistance of transmission lines in the packages are extracted. Extracted capacitances are compared with those from simulations and measurements at low frequency
Keywords :
S-parameters; ball grid arrays; capacitance; circuit simulation; electric resistance; inductance; integrated circuit measurement; integrated circuit packaging; BGA packages; S-parameter measurements; ball grid array packages; capacitance; electrical characterization; extracted capacitances; inductance; low frequency measurements; package transmission lines; resistance; simulated capacitances; simulation; single-port S-parameter measurements; Capacitance measurement; Distributed parameter circuits; Electric variables measurement; Electrical resistance measurement; Electronics packaging; Equivalent circuits; Frequency; Inductance; Scattering parameters; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733750
