Title :
Hybrid chip-scale optical interconnects using multiple quantum well devices bonded to silicon
Author :
Nair, R. ; Tian Gu ; Haney, Michael W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
Abstract :
A hybrid MQW-device-based chip-scale optical interconnect is demonstrated. Novel small-footprint couplers are fabricated with gray-scale lithography to enable high-density fabrics and low-capacitance devices, with sub-pJ/b link performance. Contrast ratio and refined coupler results are presented.
Keywords :
elemental semiconductors; integrated optoelectronics; optical couplers; optical fabrication; optical interconnections; photolithography; quantum well devices; silicon; Si; gray-scale lithography; high-density fabrics; hybrid MQW-device; hybrid chip-scale optical interconnects; low-capacitance devices; multiple quantum well devices; refined coupler; silicon; small-footprint couplers; sub-pJ/b link; Couplers; Optical coupling; Optical device fabrication; Optical interconnections; Optical waveguides; Quantum well devices; Silicon;
Conference_Titel :
Optical Interconnects Conference, 2012 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4577-1620-1
DOI :
10.1109/OIC.2012.6224469
