DocumentCode
2404623
Title
Highly-efficient, low-noise Si hybrid laser using flip-chip bonded SOA
Author
Tanaka, Shinsuke ; Jeong, Seok-Hwan ; Sekiguchi, Shigeaki ; Kurahashi, Teruo ; Tanaka, Yu ; Morito, Ken
Author_Institution
Fujitsu Labs. Ltd., Atsugi, Japan
fYear
2012
fDate
20-23 May 2012
Firstpage
12
Lastpage
13
Abstract
We developed a Si hybrid laser integrating Si wavelength filter and flip-chip bonded SOA. A high-output-power of 14.4 mW and wall-plug efficiency of 6.2% were obtained together with a low RIN level of <;-135 dB/Hz.
Keywords
flip-chip devices; integrated optoelectronics; laser noise; optical filters; semiconductor optical amplifiers; silicon-on-insulator; waveguide lasers; Si; flip-chip bonded SOA; high-output-power; highly-efficient low-noise Si hybrid laser; integrated wavelength filter; low RIN level; power 14.4 mW; wall-plug efficiency; Optical transmitters; Optical waveguides; Power generation; Semiconductor optical amplifiers; Silicon; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Interconnects Conference, 2012 IEEE
Conference_Location
Santa Fe, NM
Print_ISBN
978-1-4577-1620-1
Type
conf
DOI
10.1109/OIC.2012.6224472
Filename
6224472
Link To Document