DocumentCode :
2404655
Title :
Reliability of GaAs PHEMT under hydrogen containing atmosphere
Author :
Hu, W.W. ; Parks, E.P. ; Yu, T.H. ; Chao, P.C. ; Swanson, A.W.
Author_Institution :
Martin Marietta Labs., Syracuse, NY, USA
fYear :
1994
fDate :
16-19 Oct. 1994
Firstpage :
247
Lastpage :
250
Abstract :
Degradation of PHEMTs by hydrogen was verified by DC life tests in the hermetic packages and in the forming gases containing different hydrogen concentrations. We have found that a hydrogen partial pressure in the order of 2 torr will cause Ids change by 20% in about 800 hours at 125/spl deg/C and about 300 hours at 150/spl deg/C. The signature of hydrogen degradation is a sudden and significant drain current degradation followed by some recovery. It appeared that the degradation is both temperature and H/sub 2/ partial pressure dependent. Failure analysis indicates that the degradation is localized under the gate and that the major failure mechanism is due to the effective gate voltage being modified negatively by the atomic hydrogen.
Keywords :
III-V semiconductors; failure analysis; gallium arsenide; high electron mobility transistors; hydrogen; life testing; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; DC life tests; GaAs; H degradation; H/sub 2/; H/sub 2/ partial pressure dependence; HEMT degradation; PHEMT; drain current degradation; effective gate voltage modification; failure analysis; failure mechanism; forming gases; hermetic packages; hydrogen containing atmosphere; temperature dependance; Atmosphere; Degradation; Failure analysis; Gallium arsenide; Gases; Hydrogen; Intrusion detection; Life testing; PHEMTs; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1994. Technical Digest 1994., 16th Annual
Conference_Location :
Phildelphia, PA, USA
ISSN :
1064-7775
Print_ISBN :
0-7803-1975-3
Type :
conf
DOI :
10.1109/GAAS.1994.636977
Filename :
636977
Link To Document :
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