• DocumentCode
    2404759
  • Title

    Direct bonding for silicon photonics

  • Author

    Augendre, E. ; Fedeli, J.M. ; Bordel, D. ; Ben Bakir, B. ; Kopp, C. ; Grenouillet, L. ; Hartmann, J.-M. ; Harduin, J. ; Philippe, P. ; Olivier, N. ; Fournier, M. ; Zussy, M. ; Lefebvre, K. ; Sturm, J. ; Cioccio, L. Di ; Fulbert, L. ; Clavelier, L.

  • Author_Institution
    LETI, CEA, Grenoble, France
  • fYear
    2010
  • fDate
    14-16 Dec. 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In this paper, we discuss the requirements of direct bonding and show how it can provide photonic electronic integrated circuits including surface grating couplers, Ge photodiodes and energy-efficient hybrid Si/III-V lasers.
  • Keywords
    elemental semiconductors; germanium; integrated optoelectronics; optical couplers; photodiodes; silicon; silicon compounds; silicon-on-insulator; Ge; Si-SiO2; direct bonding; energy-efficient hybrid lasers; photodiodes; photonic electronic integrated circuits; photonics; surface grating couplers; Bonding; Photodiodes; Photonics; Silicon; Substrates; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photonics Global Conference (PGC), 2010
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-9882-6
  • Type

    conf

  • DOI
    10.1109/PGC.2010.5705965
  • Filename
    5705965
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2404759