Title :
Manufacturing of board level waveguide bus using hard mold
Author :
Xiaohui Lin ; Xinyuan Dou ; Hosseini, Amir ; Wang, Alan X. ; Chen, Ray T.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Texas at Austin, Austin, TX, USA
Abstract :
Optical interconnects of straight waveguides and bi-directional bus architecture have been successfully fabricated on flexible substrate using nickel hard mold. Optical out-of-plane loss test and high speed data transmission at 10Gbps have been demonstrated.
Keywords :
moulding; nickel; optical fabrication; optical interconnections; optical losses; optical testing; optical waveguides; system buses; bidirectional bus architecture; board level waveguide bus; flexible substrate; nickel hard mold; optical interconnects; optical out-of-plane loss test; straight waveguides; Data communication; High speed optical techniques; Optical device fabrication; Optical interconnections; Optical waveguides; Plastics;
Conference_Titel :
Optical Interconnects Conference, 2012 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4577-1620-1
DOI :
10.1109/OIC.2012.6224484
