DocumentCode
2405215
Title
Feeding structures for packaged multifinger power transistors
Author
Breitkreutz, B. ; Schmückle, F.J. ; Heinrich, W.
Author_Institution
Ferdinand-Braun-Inst. fur Hochstfrequenztechnik (FBH), Berlin
fYear
2007
fDate
9-12 Oct. 2007
Firstpage
146
Lastpage
149
Abstract
Power transistors consist of a large number of cells, which are fed by a long row of parallel bonding wires. All cells are to be operated synchronously in order to avoid output power degradation. When increasing the number of unit cells or the frequency this condition becomes more and more critical. This paper investigates the underlying effects and presents improvements of such feeding structures in the frequency range up to 10 GHz.
Keywords
microwave power transistors; wires (electric); feeding structures; packaged multifinger power transistors; parallel bonding wires; Bonding; Connectors; Finite difference methods; Frequency; Microstrip; Packaging; Power generation; Power transistors; Surface impedance; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2007. European
Conference_Location
Munich
Print_ISBN
978-2-87487-001-9
Type
conf
DOI
10.1109/EUMC.2007.4405147
Filename
4405147
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