• DocumentCode
    2405215
  • Title

    Feeding structures for packaged multifinger power transistors

  • Author

    Breitkreutz, B. ; Schmückle, F.J. ; Heinrich, W.

  • Author_Institution
    Ferdinand-Braun-Inst. fur Hochstfrequenztechnik (FBH), Berlin
  • fYear
    2007
  • fDate
    9-12 Oct. 2007
  • Firstpage
    146
  • Lastpage
    149
  • Abstract
    Power transistors consist of a large number of cells, which are fed by a long row of parallel bonding wires. All cells are to be operated synchronously in order to avoid output power degradation. When increasing the number of unit cells or the frequency this condition becomes more and more critical. This paper investigates the underlying effects and presents improvements of such feeding structures in the frequency range up to 10 GHz.
  • Keywords
    microwave power transistors; wires (electric); feeding structures; packaged multifinger power transistors; parallel bonding wires; Bonding; Connectors; Finite difference methods; Frequency; Microstrip; Packaging; Power generation; Power transistors; Surface impedance; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2007. European
  • Conference_Location
    Munich
  • Print_ISBN
    978-2-87487-001-9
  • Type

    conf

  • DOI
    10.1109/EUMC.2007.4405147
  • Filename
    4405147