DocumentCode
2405465
Title
Shape evolution during through-mask electrochemical micromachining at low and high aspect ratio
Author
Dikusar, A.L. ; Keloglu, O.Yu. ; Yushchenko, S.P.
Author_Institution
Inst. of Appl. Phys., Acad. of Sci., Kishinev, Moldova
Volume
2
fYear
1998
fDate
6-10 Oct 1998
Firstpage
557
Abstract
Shape evolution during through-mask electrochemical micromachining was investigated to study the problem of dissolution (electrodeposition) uniformity at low and high aspect ratio. Mathematical model to predict shape evolution by assuming primary current distribution is advanced. The results of calculation are compared with the experimental data on anodic dissolution of copper in neutral nitrate solutions
Keywords
dissolving; electrodeposition; masks; micromachining; Cu; anodic dissolution; aspect ratio; copper; current distribution; electrodeposition; mathematical model; neutral nitrate solution; shape evolution; through-mask electrochemical micromachining; Copper; Current distribution; Dielectrics and electrical insulation; Electrodes; Etching; Mathematical model; Metal-insulator structures; Micromachining; Resists; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International
Conference_Location
Sinaia
Print_ISBN
0-7803-4432-4
Type
conf
DOI
10.1109/SMICND.1998.733811
Filename
733811
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