Losses in multilevel crossover in VLSI interconnects

Author

Datta, P.K. ; Sanyal, S. ; Bhattacharya, D.

Author_Institution

Dept. of Electron. & Electr. Commun. Eng., Indian Inst. of Technol., Kharagpur, India

fYear

2002

fDate

2002

Firstpage

142

Lastpage

146

Abstract

The radiation and surface wave losses may give rise to electromagnetic interference (EMI) problems in high speed VLSI interconnects. Over and above this there will be dielectric and conductor losses. These losses have been evaluated for multilevel interconnects by finite difference time domain (FDTD) technique. The crosstalk between lines in the same level as well as in different levels and propagation delays are also found

Keywords

VLSI; crosstalk; delays; electromagnetic interference; finite difference time-domain analysis; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; losses; EMI; VLSI interconnects; conductor losses; crosstalk; dielectric losses; electromagnetic interference; finite difference time domain technique; high speed VLSI; multilevel crossover; propagation delays; radiation losses; surface wave losses; Conductors; Crosstalk; Dielectric losses; Electromagnetic interference; Electromagnetic radiation; Finite difference methods; Propagation delay; Surface waves; Time domain analysis; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference, 2002. Proceedings of ASP-DAC 2002. 7th Asia and South Pacific and the 15th International Conference on VLSI Design. Proceedings.

Conference_Location

Bangalore

Print_ISBN

0-7695-1441-3

Type

conf

DOI

10.1109/ASPDAC.2002.994905

Filename

994905