A novel high isolation interconnect for broadband mixed signal silicon MMICs

Author

Qian, Yongxi ; Chang, M. Frank ; Itoh, Tatsuo

Author_Institution

Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

79

Lastpage

82

Abstract

A novel interconnect and packaging concept for high-density, broadband mixed signal silicon MMICs is presented. Compared to conventional microstrip or stripline-based structures, the proposed silicon/metal/polyimide (SIMPOL) interconnect is very promising for extremely high isolation (>100 dB) between adjacent channels from DC up to 50 GHz, as indicated by simulations using a pre-verified full-wave FDTD code

Keywords

MMIC; circuit simulation; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; isolation technology; mixed analogue-digital integrated circuits; polymer films; 0 Hz to 50 GHz; SIMPOL interconnect; Si; adjacent channel isolation; broadband mixed signal silicon MMICs; high isolation interconnect; high-density mixed signal silicon MMICs; interconnect; isolation; microstrip-based structures; packaging; pre-verified full-wave FDTD code; silicon/metal/polyimide interconnect; simulation; stripline-based structures; Crosstalk; Integrated circuit interconnections; MMICs; Microstrip; Packaging; Polyimides; RF signals; Radio frequency; Silicon; Stripline;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733839

Filename

733839