Title :
Investigations of multi-layer ceramic-based MCM technology
Author :
Sutono, A. ; Pham, A. ; Laskar, J. ; Smith, W.R.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present the design and characterization of a 20-layer ceramic-based multichip module (MCM-C) using low temperature co-fired ceramic (LTCC) at microwave frequencies. Various aspects of this technology have been experimentally investigated, including material properties, the Q factor of passive devices and 3D (multilayer) interconnects. We establish the design rules and demonstrate the feasibility of utilizing LTCC for multi-layer microwave packaging
Keywords :
Q-factor; ceramic packaging; integrated circuit design; integrated circuit packaging; integrated circuit testing; microwave integrated circuits; multichip modules; 3D multilayer interconnects; LTCC multilayer microwave packaging; MCM-C; MCM-C characterization; MCM-C design; Q factor; ceramic-based multichip module; design rules; low temperature co-fired ceramic; material properties; microwave frequencies; multilayer ceramic-based MCM technology; multilayer microwave packaging; passive devices; Calibration; Ceramics; Conducting materials; Coplanar waveguides; Frequency; Impedance; Inductors; Microwave technology; Packaging; Permittivity;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733854
