Investigations of multi-layer ceramic-based MCM technology

Author

Sutono, A. ; Pham, A. ; Laskar, J. ; Smith, W.R.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

83

Lastpage

86

Abstract

We present the design and characterization of a 20-layer ceramic-based multichip module (MCM-C) using low temperature co-fired ceramic (LTCC) at microwave frequencies. Various aspects of this technology have been experimentally investigated, including material properties, the Q factor of passive devices and 3D (multilayer) interconnects. We establish the design rules and demonstrate the feasibility of utilizing LTCC for multi-layer microwave packaging

Keywords

Q-factor; ceramic packaging; integrated circuit design; integrated circuit packaging; integrated circuit testing; microwave integrated circuits; multichip modules; 3D multilayer interconnects; LTCC multilayer microwave packaging; MCM-C; MCM-C characterization; MCM-C design; Q factor; ceramic-based multichip module; design rules; low temperature co-fired ceramic; material properties; microwave frequencies; multilayer ceramic-based MCM technology; multilayer microwave packaging; passive devices; Calibration; Ceramics; Conducting materials; Coplanar waveguides; Frequency; Impedance; Inductors; Microwave technology; Packaging; Permittivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733854

Filename

733854