Title :
Modeling of free space holographic optical link for board level interconnect
Author :
Lin, Senmao ; Tabata, Tomohira ; Lee, Sing H. ; Jin, Mike S.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
Abstract :
We describe a systematic approach for high/low-level modeling of packaging of free space holographic optical links, which are used to fully interconnect several groups of electronic chips (e.g. processors, memory chips) on a PCB
Keywords :
holographic optical elements; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; integrated memory circuits; integrated optoelectronics; microprocessor chips; optical interconnections; PCB; board level interconnect; electronic chips; free space holographic optical link; high-level modeling; interconnect; low-level modeling; memory chips; modeling; packaging; processors; systematic modeling approach; Holographic optical components; Holography; Optical fiber communication; Optical interconnections; Optical propagation; Optical receivers; Optical recording; Optical transmitters; Packaging; Space technology;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733857
