• DocumentCode
    2406288
  • Title

    Modeling of free space holographic optical link for board level interconnect

  • Author

    Lin, Senmao ; Tabata, Tomohira ; Lee, Sing H. ; Jin, Mike S.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
  • fYear
    1998
  • fDate
    26-28 Oct 1998
  • Firstpage
    87
  • Lastpage
    90
  • Abstract
    We describe a systematic approach for high/low-level modeling of packaging of free space holographic optical links, which are used to fully interconnect several groups of electronic chips (e.g. processors, memory chips) on a PCB
  • Keywords
    holographic optical elements; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; integrated memory circuits; integrated optoelectronics; microprocessor chips; optical interconnections; PCB; board level interconnect; electronic chips; free space holographic optical link; high-level modeling; interconnect; low-level modeling; memory chips; modeling; packaging; processors; systematic modeling approach; Holographic optical components; Holography; Optical fiber communication; Optical interconnections; Optical propagation; Optical receivers; Optical recording; Optical transmitters; Packaging; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
  • Conference_Location
    West Point, NY
  • Print_ISBN
    0-7803-4965-2
  • Type

    conf

  • DOI
    10.1109/EPEP.1998.733857
  • Filename
    733857
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2406288