Title :
Considerations of characterizing standard SMT packages for RFIC applications
Author :
Deng, Joseph D S ; Chiou, Hwann-Kaeo
Author_Institution :
Chung Shan Inst. of Sci. & Technol., Lung-Tan, Taiwan
Abstract :
Modeling of the RF characteristics of commercial SMT packages is discussed in this paper. The modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques to the package leads for the initial electrical parameters of a package. Then, a direct lead measurement was performed to model the package for wireless communication applications. Package ground inductance and the number of grounded leads are presented. Back-to-back package measurements were made to verify the package parameters
Keywords :
MMIC; inductance; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; mobile radio; plastic packaging; surface mount technology; C-matrix techniques; L-matrix techniques; RF characteristics; RFIC applications; SMT package characterization; back-to-back package measurements; commercial SMT packages; direct lead measurement; grounded leads; modeling; package electrical parameters; package ground inductance; package leads; package model; package parameters; round inductance extraction techniques; standard SMT packages; wireless communication applications; Boundary conditions; Capacitance; Inductance measurement; Packaging; Performance evaluation; Radio frequency; Radiofrequency integrated circuits; Surface-mount technology; Transmission line matrix methods; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733866
