Considerations of characterizing standard SMT packages for RFIC applications

Author

Deng, Joseph D S ; Chiou, Hwann-Kaeo

Author_Institution

Chung Shan Inst. of Sci. & Technol., Lung-Tan, Taiwan

fYear

1998

fDate

26-28 Oct 1998

Firstpage

97

Lastpage

100

Abstract

Modeling of the RF characteristics of commercial SMT packages is discussed in this paper. The modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques to the package leads for the initial electrical parameters of a package. Then, a direct lead measurement was performed to model the package for wireless communication applications. Package ground inductance and the number of grounded leads are presented. Back-to-back package measurements were made to verify the package parameters

Keywords

MMIC; inductance; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; mobile radio; plastic packaging; surface mount technology; C-matrix techniques; L-matrix techniques; RF characteristics; RFIC applications; SMT package characterization; back-to-back package measurements; commercial SMT packages; direct lead measurement; grounded leads; modeling; package electrical parameters; package ground inductance; package leads; package model; package parameters; round inductance extraction techniques; standard SMT packages; wireless communication applications; Boundary conditions; Capacitance; Inductance measurement; Packaging; Performance evaluation; Radio frequency; Radiofrequency integrated circuits; Surface-mount technology; Transmission line matrix methods; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733866

Filename

733866