DocumentCode
2406480
Title
On De-Embedding Phase for High Speed Connectors
Author
Morales, Aldo ; Agili, Sedig ; Gaddala, Shilpa
Author_Institution
Electr. Eng. Program, Penn State Univ. at Harrisburg, Harrisburg, PA
fYear
2008
fDate
9-13 Jan. 2008
Firstpage
1
Lastpage
2
Abstract
The phase error problem in de-embedding is examined for board structures and devices under test (DUT). The main feature of this paper is the comparison between the S-parameter data for the embedded DUT and the data for a judiciously chosen reference situation. It is important to note that de-embedding the phase is essential in the design of high-speed connectors in consumer electronics hardware, especially in providing "swappable" models for high-end microprocessor-based applications.
Keywords
S-parameters; integrated circuit testing; microprocessor chips; S-parameter data; consumer electronics hardware; deembedding phase; devices under test; high speed connectors; microprocessor-based applications; phase error problem; swappable models; Calibration; Connectors; Consumer electronics; Equivalent circuits; Frequency measurement; Hardware; Length measurement; Microstrip components; Phase measurement; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Consumer Electronics, 2008. ICCE 2008. Digest of Technical Papers. International Conference on
Conference_Location
Las Vegas, NV
Print_ISBN
978-1-4244-1458-1
Electronic_ISBN
978-1-4244-1459-8
Type
conf
DOI
10.1109/ICCE.2008.4588007
Filename
4588007
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