• DocumentCode
    2406480
  • Title

    On De-Embedding Phase for High Speed Connectors

  • Author

    Morales, Aldo ; Agili, Sedig ; Gaddala, Shilpa

  • Author_Institution
    Electr. Eng. Program, Penn State Univ. at Harrisburg, Harrisburg, PA
  • fYear
    2008
  • fDate
    9-13 Jan. 2008
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The phase error problem in de-embedding is examined for board structures and devices under test (DUT). The main feature of this paper is the comparison between the S-parameter data for the embedded DUT and the data for a judiciously chosen reference situation. It is important to note that de-embedding the phase is essential in the design of high-speed connectors in consumer electronics hardware, especially in providing "swappable" models for high-end microprocessor-based applications.
  • Keywords
    S-parameters; integrated circuit testing; microprocessor chips; S-parameter data; consumer electronics hardware; deembedding phase; devices under test; high speed connectors; microprocessor-based applications; phase error problem; swappable models; Calibration; Connectors; Consumer electronics; Equivalent circuits; Frequency measurement; Hardware; Length measurement; Microstrip components; Phase measurement; Scattering parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Consumer Electronics, 2008. ICCE 2008. Digest of Technical Papers. International Conference on
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    978-1-4244-1458-1
  • Electronic_ISBN
    978-1-4244-1459-8
  • Type

    conf

  • DOI
    10.1109/ICCE.2008.4588007
  • Filename
    4588007