DocumentCode
2406920
Title
Device design for subthreshold slope and threshold voltage control in sub-100 nm fully-depleted SOI MOSFETs
Author
Numata, Toshinori ; Uchida, Ken ; Koga, Junji ; Takagi, Shin-ichi
Author_Institution
Adv. LSI Technol. Lab., Toshiba Corp., Yokohama, Japan
fYear
2002
fDate
7-10 Oct 2002
Firstpage
179
Lastpage
180
Abstract
Device design issues regarding threshold voltage (Vth) control, short channel effects (SCE) and subthreshold slope are quantitatively studied for fully-depleted (FD) SOI MOSFETs under the sub-100 nm regime. As for the Vth adjustment method, the combination of back gate bias (Vg2) and gate work function (Φm) control is found to provide superior SCE, Vth fluctuation due to SOI thickness variation and current drive. As for the subthreshold slope (SS), on the other hand, the optimization of thickness and permittivity of buried oxides is a key issue. It is found that, when the gate length is less than 100 nm, SS has a minimum value at buried oxide thickness of around 40 nm, irrespective of SOI thickness. It is also shown that the reduction in the permittivity of buried oxides improves SS.
Keywords
MOSFET; semiconductor device models; silicon-on-insulator; work function; SOI thickness; back gate bias; device design; fully-depleted SOI MOSFETs; gate length; gate work function; oxide permittivity; oxide thickness; short channel effects; subthreshold slope; threshold voltage; MOSFETs; Semiconductor device modeling; Silicon on insulator technology; Work function;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, IEEE International 2002
Print_ISBN
0-7803-7439-8
Type
conf
DOI
10.1109/SOI.2002.1044467
Filename
1044467
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