Evaluation and optimization of MCM-BGA packages

Author

Simsek, Arzu ; Reichl, H.

Author_Institution

Fraunhofer Inst. FhG-IZM, Berlin, Germany

fYear

1998

fDate

26-28 Oct 1998

Firstpage

132

Lastpage

135

Abstract

Electrical characterization of BGA packages becomes significant during the package development stage. Fraunhofer IZM, Blaupunkt and BMW have designed test vehicles together with other project partners in order to investigate different BGA structures for automotive applications. The electrical characteristics of a MCM-BGA were evaluated and fed back to design in order to meet the target requirements. Results of the investigations are reported

Keywords

automotive electronics; ball grid arrays; circuit optimisation; circuit simulation; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; multichip modules; BGA packages; BGA structures; MCM-BGA; MCM-BGA package evaluation; MCM-BGA package optimization; MCM-BGA packages; automotive applications; design target requirements; electrical characteristics; electrical characterization; package development; test vehicles; Analytical models; Automotive engineering; Dielectrics; Electric variables; Electromagnetic propagation; Electronics packaging; Flip chip; Microassembly; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733914

Filename

733914