Full-wave electromagnetic modeling of interconnects with meshed ground planes

Author

Mathis, Andrew W. ; Peterson, Andrew F.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

136

Lastpage

139

Abstract

An integral equation method for analysis of interconnects in the presence of meshed ground planes is presented. The integral equation is solved to produce the electric currents on the interconnect while the ground plane perforations are accounted for by a numerical Green´s function. Numerical results for a microstrip transmission line with a perforated ground plane are presented

Keywords

Green´s function methods; electric current; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microstrip lines; electric currents; full-wave electromagnetic modeling; ground plane perforations; integral equation; integral equation method; interconnect analysis; interconnects; meshed ground planes; microstrip transmission line; numerical Green´s function; perforated ground plane; Apertures; Current; Electromagnetic modeling; Green´s function methods; Impedance; Integral equations; Microstrip; Permittivity; Strips; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733917

Filename

733917