Title :
Full-wave electromagnetic modeling of interconnects with meshed ground planes
Author :
Mathis, Andrew W. ; Peterson, Andrew F.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
An integral equation method for analysis of interconnects in the presence of meshed ground planes is presented. The integral equation is solved to produce the electric currents on the interconnect while the ground plane perforations are accounted for by a numerical Green´s function. Numerical results for a microstrip transmission line with a perforated ground plane are presented
Keywords :
Green´s function methods; electric current; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microstrip lines; electric currents; full-wave electromagnetic modeling; ground plane perforations; integral equation; integral equation method; interconnect analysis; interconnects; meshed ground planes; microstrip transmission line; numerical Green´s function; perforated ground plane; Apertures; Current; Electromagnetic modeling; Green´s function methods; Impedance; Integral equations; Microstrip; Permittivity; Strips; Transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733917
