Title :
Fast method for the prediction of the capacitance of via through-holes
Author :
Jegannathan, S. ; De Zutter, Daniël ; Van den Berghe, Steve
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
Abstract :
In this paper, a fast method for the prediction of the excess capacitance of vias is proposed. The effect of the connecting lines is also examined. Numerical simulations verify the validity of the method proposed. The fast method leads to an upper capacitance bound that is further reduced by the presence of the connecting lines
Keywords :
capacitance; circuit analysis computing; numerical analysis; printed circuit design; capacitance prediction; connecting line effects; connecting lines; numerical simulations; upper capacitance bound; via excess capacitance; via through-holes; Capacitance; Dielectric substrates; Green´s function methods; Information technology; Integral equations; Joining processes; Numerical simulation; Region 1; Region 3; Upper bound;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733924
