Contribution of resonance to ground bounce in lossy thin film planes

Author

Pannala, Sreemala ; Bandyopadhyay, Jaya ; Swaminathan, Madhavan ; Torres, Myra ; Smith, Larry ; Yuan, Xingchao ; Fitzgerald, Grez

Author_Institution

Center for Packaging Res., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

185

Lastpage

188

Abstract

This paper discusses the pulse propagation effects on lossy thin film package planes. The ground bounce phenomena produced by the resonance on planes has been captured using a combination of modeling techniques and measurements. A macromodeling method has been used to explain the transient phenomena by using the dominant poles and residues of the system

Keywords

circuit analysis computing; circuit resonance; losses; packaging; poles and zeros; transient analysis; dominant system poles; dominant system residues; ground bounce; ground bounce phenomena; lossy thin film package planes; lossy thin film planes; macromodeling method; measurements; modeling techniques; package plane resonance; pulse propagation effects; resonance; transient phenomena; Dielectric thin films; Frequency domain analysis; Frequency measurement; Packaging; Power system transients; Resonance; Sampling methods; Switching circuits; Time domain analysis; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733966

Filename

733966