Title :
IPFA 2008 table of contents
Abstract :
The following topics are dealt with: high-performance CMOS; advanced IC packaging; IC package reliability evaluation novel ESD device structure; BEOL metallization reliability; device package failure analysis; silicon nMOSFET characterisation; silicon pMOSFET characterisation; multisource/drain SOI MOSFET simulation; solar cells; memory cells; semiconductors physical characterization; semiconductors chemical characterization; advanced low-k interconnects; passive RFID tags; and nanowire FinFET hot carrier degradation.
Keywords :
CMOS integrated circuits; MOSFET; electronics industry; failure analysis; integrated circuit design; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated memory circuits; low-k dielectric thin films; nanoelectronics; radiofrequency identification; semiconductor device metallisation; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; silicon; silicon-on-insulator; solar cells; BEOL metallization reliability; IC package reliability evaluation; advanced IC packaging; advanced low-k interconnects; device package failure analysis; high-performance CMOS; memory cells; multisource/drain SOI MOSFET simulation; nanowire FinFET hot carrier degradation; novel ESD device structure; passive RFID tags; semiconductors chemical characterization; semiconductors physical characterization; silicon nMOSFET characterisation; silicon pMOSFET characterisation; solar cells; Dielectrics; Failure analysis; Manufacturing; Materials; Microscopy; Reliability; USA Councils;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
DOI :
10.1109/IPFA.2008.4588141
