Title :
Simple formulas to calculate the line parameters of interconnects on conducting substrates
Author :
Grabinski, Hartmut ; Konrad, Beate ; Nordholz, Peua
Author_Institution :
Lab. fur Informationstechnol., Hannover Univ., Germany
Abstract :
Since conducting substrates can significantly affect the performance of integrated circuits, models have been developed to describe the influence of the substrate on the signal propagation in interconnects in a simple way. From these models, simple formulas for accurate computation of the frequency dependent line parameters are derived and compared with numerical simulations and measurements
Keywords :
integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; numerical analysis; IC models; IC performance; conducting substrates; frequency dependent line parameters; integrated circuits; interconnects; line parameters; measurements; numerical simulation; signal propagation; substrate effects; Capacitance; Circuit simulation; Conducting materials; Conductivity; Dielectric substrates; Frequency dependence; Integrated circuit interconnections; Integrated circuit modeling; Laboratories; Numerical simulation;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733992
