Title :
CAD-oriented equivalent circuit modeling of on-chip interconnects in CMOS technology
Author :
Zheng, J. ; Tripathi, A. ; Hahm, Y.C. ; Ishii, T. ; Weisshaar, A. ; Tripathi, V.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
A CAD-oriented modeling methodology for on-chip interconnects on lossy substrates in CMOS technology, which is based on quasistatic EM analysis and equivalent circuit model extraction, is presented. The frequency response of the equivalent circuit model shows good agreement with the computed quasi-static solution over the entire frequency range of interest. The model is further validated by comparison with the interconnect step response
Keywords :
CMOS integrated circuits; circuit CAD; circuit analysis computing; equivalent circuits; frequency response; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; step response; CAD-oriented equivalent circuit modeling; CAD-oriented modeling methodology; CMOS technology; equivalent circuit model; equivalent circuit model extraction; frequency range; frequency response; interconnect step response; lossy substrates; model validation; on-chip interconnects; quasistatic EM analysis; CMOS technology; Conductivity; Conductors; Dielectric substrates; Equivalent circuits; Frequency; Integrated circuit interconnections; Semiconductor device modeling; Silicon; Skin effect;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733997
