Title :
Microelectromechanical instrument and systems development at the Charles Stark Draper Laboratory, Inc
Author :
Weinberg, M. ; Connelly, J. ; Kourepenis, A. ; Sargent, D.
Author_Institution :
Charles Stark Draper Lab. Inc., Cambridge, MA, USA
Abstract :
Draper Laboratory and Boeing North American have formed an alliance to develop very small, low-cost rate sensors for commercial and military applications. Several generation of micro-mechanical gyroscopes have been developed at Draper, using a dissolved wafer process that features single crystal Si anodically bonded to a glass substrate. Resulting sensor die size is approximately 1 mm. When integrated with applications specific integrated circuits (ASIC´s), the sensor fits in a 3 cm per side flat pack operating from a single 5V dc supply. Bias stability over temperature ranges of 0.5°C has surpassed 10°/hr. Best to date resolution and angle random walk performance is 25°/hr in 60 Hz and 0.04°/√h respectively. The sensors are extremely robust, having survived air guns tests in excess of 60,000 g´s. This technology is useful for spacecraft inertial guidance. Size, mass, and power of inertial systems can be reduced by orders of magnitude, providing benefits of paramount importance to the new class of miniature satellites, revers, and spacecraft. However, significant challenges remain before this technology is routinely available for space applications related to performance and space environmental effects. This paper discusses the principle of operation, measured and projected performance, and approaches being taken at Draper Laboratory to develop micromechanical instruments suitable for use in military and space systems
Keywords :
aerospace instrumentation; application specific integrated circuits; elemental semiconductors; gyroscopes; integrated circuit packaging; microsensors; silicon; wafer bonding; 1 mm; 3 cm; 5 V; 60 Hz; ASIC; Boeing North American; Charles Stark Draper Laboratory; Si; Si single crystal; angle random walk; anodic bonding; bias stability; commercial applications; dissolved wafer process; drift; glass substrate; linearity; low-cost rate sensors; micromechanical gyroscopes; military applications; miniature satellites; robust design; sensor fabrication; space environmental effects; spacecraft inertial guidance; Application specific integrated circuits; Circuit stability; Glass; Gyroscopes; Instruments; Laboratories; Space technology; Space vehicles; Temperature distribution; Wafer bonding;
Conference_Titel :
Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-4150-3
DOI :
10.1109/DASC.1997.637288