• DocumentCode
    2409180
  • Title

    The impact of system impedance on the characterization of high power devices

  • Author

    Sheikh, Aamir ; Tasker, Paul J. ; Lees, Jonathan ; Benedikt, Johannes

  • Author_Institution
    Cardiff Univ., Cardiff
  • fYear
    2007
  • fDate
    9-12 Oct. 2007
  • Firstpage
    949
  • Lastpage
    952
  • Abstract
    This paper focuses on the extension of the successful application of current and voltage waveform engineering of on-wafer devices to power levels relevant to both handset and basestation markets. Effects on the measured waveforms caused by a 50Omega characteristic impedance of the measurement system are investigated showing a significant effect at the lower and crucially at higher harmonics, which is in contrast to the current school of thought. For the first time a waveform based analysis of packaging affects is presented, allowing the effects of the system´s higher harmonic impedances to be studied and considered in the context of de-embedding measured waveforms. Measured de-embedded waveforms are compared with simulated equivalents model and are found to be in good agreement.
  • Keywords
    impedance matching; power semiconductor devices; semiconductor device measurement; semiconductor device packaging; semiconductor device testing; characteristic impedance; current waveform engineering; de-embedded waveforms; high power devices characterization; higher harmonic impedances; measurement system; on-wafer devices; packaging affects; system impedance; voltage waveform engineering; waveform based analysis; Current measurement; High power amplifiers; Impedance measurement; Packaging; Power amplifiers; Power engineering and energy; Power generation; Power measurement; Time measurement; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2007. European
  • Conference_Location
    Munich
  • Print_ISBN
    978-2-87487-001-9
  • Type

    conf

  • DOI
    10.1109/EUMC.2007.4405351
  • Filename
    4405351