Title :
Microwave and millimeter wave ball grid array (BGA) packages
Author_Institution :
Micro Substrates Corp., Tempe, AZ, USA
Abstract :
In order to realize the large growth potentials of commercial wireless market segments such as local multi-point distribution services (LMDS) and point-to-point radio, system manufacturers must produce affordably-priced equipment for the consumer. One key issue is reducing the cost of packaging for monolithic microwave integrated circuits (MMICs) for these applications, which operate in the frequency range of 18 to 40 GHz. This paper explores the applicability of ball-grid array (BGA) technology as an economical solution to microwave and millimeter-wave MMIC packaging
Keywords :
MIMIC; MMIC; ball grid arrays; integrated circuit design; integrated circuit packaging; integrated circuit testing; radio links; 18 to 40 GHz; BGA technology; LMDS; MMICs; ball grid array packages; consumer equipment cost; local multi-point distribution services; microwave BGA packages; microwave MMIC packaging; millimeter wave BGA packages; millimeter-wave MMIC packaging; monolithic microwave integrated circuits; operating frequency range; point-to-point radio; system manufacturers; wireless market segments; Application specific integrated circuits; Costs; Electronics packaging; Integrated circuit packaging; MMICs; Manufacturing; Microwave devices; Microwave integrated circuits; Millimeter wave technology; Packaging machines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.734004
