Title :
Electrical modeling of a BGA package for microwave applications-a layer by layer approach
Author :
Ito, Ryosuke ; Hongsmatip, Thongchai ; Jackson, Robert W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Abstract :
An electrical modeling procedure is described for ball grid arrays (BGA) to be used at microwave frequencies. A lumped element circuit model for interconnection is developed and verified by measurement. The model includes the effects of solder balls, the motherboard, and layer-to-layer transitions
Keywords :
MMIC; assembling; ball grid arrays; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; soldering; BGA package; ball grid arrays; electrical modeling; electrical modeling procedure; interconnection model; layer-by-layer electrical modeling; layer-to-layer transition effects; lumped element circuit model; microwave applications; microwave frequencies; model verification measurements; motherboard effects; solder ball effects; Automotive engineering; Circuit testing; Coaxial components; Coplanar waveguides; Costs; Feeds; Integrated circuit interconnections; Millimeter wave technology; Packaging; Radio frequency;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.734007
