Investigation of soft fail issue in sub-nanometer devices using nanoprobing technique

With the miniaturization of electronic devices, identifying the root cause of soft failures using physical failure analysis (PFA) techniques has become a more challenging task. By characterizing the electrical behavior of malfunctioned devices, nanoprobing precisely locates defects before any PFA is performed and allows for deeper understanding of the root cause of soft failure issues. Two case studies are presented to demonstrate the effectiveness of nanoprobing in investigating the root causes of soft failures.