DocumentCode :
2409698
Title :
Failure analysis of 65nm technology node SRAM soft failure
Author :
Changqing, Chen ; Er, Eddie ; Soh Ping Neo ; Khim, Loh Sock ; Qingxiao, Wang ; Teong, J.
Author_Institution :
Chartered Semicond. Mfg Ltd., Singapore
fYear :
2008
fDate :
7-11 July 2008
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, a real case of 65 nm technology node SRAM failure was studied. The failure of the SRAM is soft failure, so the traditional method was failed to localize the exact position of the failed transistor. To find the root cause, the biased current image-Atom Force Microscopy combined with Atom Force Probing was used to probe the failed cell of the SRAM to find one abnormal pass-gate transistor. Theoretical analysis combined with the probing result was performed to find the failure location. Then current image was used to confirm the failure location. According to the AFP result, TEM and EDX were performed along the active of the pass-gate. Incomplete silicidation was observed under the active contact which correlated well to the electrical analysis result.
Keywords :
SRAM chips; atomic force microscopy; failure analysis; nanotechnology; transistors; transmission electron microscopy; EDX; SRAM soft failure; TEM; atom force microscopy; atom force probing; biased current image; failed transistor; failure analysis; nanotechnology node; pass-gate transistor; size 65 nm; Atomic force microscopy; Dielectric materials; Electron beams; Failure analysis; Low voltage; Page description languages; Random access memory; Scanning electron microscopy; Transistors; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
Type :
conf
DOI :
10.1109/IPFA.2008.4588175
Filename :
4588175
Link To Document :
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