Title :
A simple method for TEM sample preparation without carbon film background
Author :
Lee, Meng-Lung ; Lin, Ren-De
Author_Institution :
United Microelectron. Corp. (Singapore Branch), Ltd., Singapore
Abstract :
The article describes a simple method to prepare TEM sample put on Cu grid without carbon support film. So that we could remove the background of carbon film while we do componential analysis.
Keywords :
carbon; copper; transmission electron microscopy; C; Cu; TEM sample preparation; componential analysis; film background; Computer aided software engineering; Costs; Electrons; Energy loss; Microelectronics; Milling; Needles; Polymer films; Probes; Signal mapping;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588176
