Title :
IC package inspection with nanofocus X-ray tubes and nanoCT
Author :
Roth, Holger ; He, Zhenhui ; Paul, Thomas
Author_Institution :
Applic. Lab. Stuttgart, Phoenix|x-ray Syst. + Services GmbH, Stuttgart
Abstract :
Nanofocus tube technology in combination with high resolution CT are the driving forces in X-ray and the leading future technologies for the inspection of IC packages. The paper shows different results of highest resolution failure analysis performed with latest 2D and 3D nanofocus techniques like the first 180 kV nanoCT system.
Keywords :
X-ray apparatus; computerised tomography; integrated circuit packaging; 2D nanofocus techniques; 3D nanofocus techniques; highest resolution failure analysis; integrated circuit package inspection; nanocomputerised tomography; nanofocus X-ray tubes; nanofocus tube technology; voltage 180 kV; Bonding; Computed tomography; Copper; Detectors; Image edge detection; Image resolution; Inspection; Integrated circuit packaging; Laboratories; X-ray imaging;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588179
