Title :
The application of the TLM method to the simulation of high-speed and high-complexity electronic systems
Author :
Christopoulos, Christos ; Vukovic, Ana
Author_Institution :
Numerical Modelling Lab., Nottingham Univ., UK
Abstract :
The paper describes the current state of time-domain simulation methods, with an emphasis on transmission line modelling (TLM), and their application to problems in electronic circuit interconnection and packaging. Illustrative results from simulations are also presented
Keywords :
circuit simulation; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; time-domain analysis; transmission line theory; TLM method; electronic circuit interconnection; electronic circuit packaging; high-complexity electronic systems; high-speed electronic systems; simulation; time-domain simulation methods; transmission line modelling; Circuit simulation; Electronic circuits; Electronics packaging; Finite difference methods; Frequency; Integrated circuit interconnections; Resonance; Shape control; Spatial resolution; Time domain analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.734039
