DocumentCode
2409986
Title
Numerical modeling of packaging effects using the finite-difference time-domain technique
Author
Piket-May, Melinda ; Rumsey, Ian ; Byers, Andrew ; Boots, Bryan ; Thomas, Kevin ; Gravrok, Roger
Author_Institution
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
fYear
1998
fDate
26-28 Oct 1998
Firstpage
264
Lastpage
266
Abstract
This paper presents an overview of research using the finite-difference time-domain (FDTD) technique to study packaging effects on product functional characteristics, covering a broad range of topics coupled by the common theme of improving current state of the art packaging and interconnect design. Work being done by research and design teams throughout the world is summarized
Keywords
finite difference time-domain analysis; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; reviews; FDTD technique; finite-difference time-domain technique; interconnect design; numerical modeling; packaging; packaging design; packaging effects; product functional characteristics; Finite difference methods; Frequency; Impedance; Integrated circuit interconnections; Maxwell equations; Numerical models; Packaging; Propagation delay; Time domain analysis; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location
West Point, NY
Print_ISBN
0-7803-4965-2
Type
conf
DOI
10.1109/EPEP.1998.734041
Filename
734041
Link To Document