Title :
Numerical modeling of packaging effects using the finite-difference time-domain technique
Author :
Piket-May, Melinda ; Rumsey, Ian ; Byers, Andrew ; Boots, Bryan ; Thomas, Kevin ; Gravrok, Roger
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
This paper presents an overview of research using the finite-difference time-domain (FDTD) technique to study packaging effects on product functional characteristics, covering a broad range of topics coupled by the common theme of improving current state of the art packaging and interconnect design. Work being done by research and design teams throughout the world is summarized
Keywords :
finite difference time-domain analysis; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; reviews; FDTD technique; finite-difference time-domain technique; interconnect design; numerical modeling; packaging; packaging design; packaging effects; product functional characteristics; Finite difference methods; Frequency; Impedance; Integrated circuit interconnections; Maxwell equations; Numerical models; Packaging; Propagation delay; Time domain analysis; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.734041
