Title :
Flip-chip mounted 1:4 demultiplexer IC in InP DHBT technology operating up to 100 Gb/s
Author :
Kärnfelt, Camilla ; Hallin, Joakim ; Kjellberg, Torgil ; Hansson, Bertil ; Swahn, Thomas
Author_Institution :
Chalmers Univ. of Technol., Goteborg
Abstract :
Operation of a packaged 1:4 demultiplexer (DEMUX) in InP DHBT technology for an input data rate of up to 100 Gb/s is presented. The DEMUX IC is flip-chip mounted in a microwave package consisting of an aluminum nitride substrate with coplanar waveguides placed in a Kovar/MoCu housing with coaxial V-connectors. The DEMUX was operated at a supply voltage of-3.5 V and consumes 2.1 W.
Keywords :
III-V semiconductors; bipolar integrated circuits; demultiplexing equipment; flip-chip devices; heterojunction bipolar transistors; DHBT technology operating; InP; Kovar/MoCu housing; bit rate 100 Gbit/s; coplanar waveguides; demultiplexer IC; flip-chip; microwave package; power 2.1 W; voltage -3.5 V; Aluminum nitride; Architecture; Assembly; Clocks; Conducting materials; DH-HEMTs; Indium phosphide; Integrated circuit packaging; Microwave integrated circuits; Microwave technology;
Conference_Titel :
Microwave Conference, 2007. European
Conference_Location :
Munich
Print_ISBN :
978-2-87487-001-9
DOI :
10.1109/EUMC.2007.4405395
