DocumentCode
2410174
Title
DNA as template for nanobonding and novel nanoelectronic components
Author
Weigel-Jech, Michael ; Fatikow, Sergej
Author_Institution
Div. Microrobotics & Control Eng., Univ. of Oldenburg, Oldenburg, Germany
fYear
2012
fDate
14-18 May 2012
Firstpage
5068
Lastpage
5073
Abstract
The importance of nanoelectronics for the future is well-recognized. Next-generation nanoelectronic technologies, for the usage in intelligent implants, intelligent drugs or even ICs for the coupling of destroyed nerves, are sensitive to dimensional change. Therefore, an appropriate packaging is essential to the success or failure of these technologies. In this paper current work to use DNA as a template for bonding at the nanoscale and for novel nanoelectronic components is presented. Moreover, a method is presented, which enables the handling and manipulation of DNA at dry conditions, thus enabling the feasible usage for industrial purposes as well as for science. For this the necessary steps, starting with the immobilization and choice of useable nanowires, followed by the extraction and separation of these wires, the coarse positioning, the immobilization onto the target substrates as well as a proper fine tuning at the target are presented.
Keywords
DNA; electronics packaging; failure analysis; lead bonding; nanoelectronics; nanowires; DNA manipulation; IC; electronics packaging; intelligent drugs; intelligent implants; nanoelectronic components; nanoscale bonding; nanowire extraction; next-generation nanoelectronic technology; DNA; Gold; Nanoelectronics; Nanowires; Silicon; Substrates; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation (ICRA), 2012 IEEE International Conference on
Conference_Location
Saint Paul, MN
ISSN
1050-4729
Print_ISBN
978-1-4673-1403-9
Electronic_ISBN
1050-4729
Type
conf
DOI
10.1109/ICRA.2012.6224804
Filename
6224804
Link To Document