DocumentCode
2410372
Title
Tool cleanliness characterization for improving productivity and yields
Author
Chia, Victor K.F.
Author_Institution
Balazs NanoAnalysis, Singapore
fYear
2008
fDate
7-11 July 2008
Firstpage
1
Lastpage
3
Abstract
Tool cleanliness is a prerequisite for increased production ramp, reduced tool down-time and high process yields. Any materials used in the build of material (BOM) must be verified to be clean both in the bulk of the material and on its surface after machining and cleaning. Bulk analyses are destructive due to the nature of the test and the information required. In contrast, surface analyses should be non-destructive so the part may be re-used after surface cleanliness testing or re-cleaned if the test indicates the part does not pass its cleanliness specification. Wafer tool specifications are in place for particles and metals by the original equipment manufacturers (OEMs). Particle specification depends on the method of wafer clamping and wafer metal specification for tool acceptance is typically in the range of 1-5times1010 atoms/cm2. No generally accepted organic specifications are in place. Currently, there are no accepted tool parts particle, metal and organic specifications. Very few machine shops, cleaning houses, OEMs and fabs have developed baseline tool parts cleanliness specifications. This paper describes key analytical techniques for bulk and surface characterization of tool parts.
Keywords
integrated circuit manufacture; machine tools; nondestructive testing; surface cleaning; surface contamination; build-of-material; bulk characterization; machining; nondestructive testing; organic specification; original equipment manufacturers; process yield; production ramp; productivity; surface characterization; surface cleanliness testing; tool acceptance; tool cleanliness characterization; wafer clamping specification; wafer tool specification; Bills of materials; Clamps; Information analysis; Machine shops; Machining; Manufacturing; Nondestructive testing; Production; Productivity; Surface cleaning;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location
Singapore
Print_ISBN
978-1-4244-2039-1
Electronic_ISBN
978-1-4244-2040-7
Type
conf
DOI
10.1109/IPFA.2008.4588205
Filename
4588205
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