DocumentCode :
2410452
Title :
Current-induced breakdown of carbon nanofiber interconnects
Author :
Kitsuki, Hirohiko ; Saito, Tsutomu ; Yamada, Toshishige ; Fabris, Drazen ; Wilhite, Patrick ; Suzuki, Makoto ; Yang, Cary Y.
Author_Institution :
Center for Nanostruct., Santa Clara Univ., Santa Clara, CA
fYear :
2008
fDate :
7-11 July 2008
Firstpage :
1
Lastpage :
4
Abstract :
Current-induced breakdown phenomena of carbon nanofibers (CNFs) for future on-chip interconnect applications are presented. The effect of heat dissipation via the underlying substrate is studied using different experimental configurations. Scanning electron microscopy (SEM) techniques are utilized to study the structural damage by current stress. While the measured maximum current density in the suspended CNF in air is inversely proportional to nanofiber length and independent of diameter, SiO2-supported CNFs improves their current capacity, which implies effective heat dissipation to the oxide. The correlation between maximum current density and electrical resistivity confirms the importance of local Joule heating, showing strong coupling between electrical and thermal transport in CNFs.
Keywords :
carbon nanotubes; integrated circuit interconnections; silicon compounds; system-on-chip; Joule heating; SiO2; carbon nanofiber; current induced breakdown; electrical resistivity; heat dissipation; maximum current density; on chip interconnect; scanning electron microscopy; Couplings; Current density; Current measurement; Density measurement; Electric breakdown; Electric resistance; Length measurement; Resistance heating; Scanning electron microscopy; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
Type :
conf
DOI :
10.1109/IPFA.2008.4588210
Filename :
4588210
Link To Document :
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