DocumentCode
2410793
Title
Communications via Systems-on-Chips Clustering in Large-Scaled Sensor Networks
Author
Fan, Sharon ; Fan, Jeffrey ; Makki, Kia ; Pissinou, Nikki
Author_Institution
Dept. of Electr. & Comput. Eng., Florida Int. Univ., Miami, FL
Volume
2
fYear
2008
fDate
17-20 Dec. 2008
Firstpage
549
Lastpage
552
Abstract
In this paper, we have proposed a framework of systems-on-chips clustering in application to complicated sensor networks. The framework can be applied to address the communication issues in distributed and large-scaled sensor nodes in wireless sensor network application. There are two communication categories under consideration, i.e. intra-nodes and inter-nodes. Due to the potentially higher frequency in the signal propagation within the sensor node, the characteristics of the interconnect among various systems-on-chips cannot be described in the traditionally lumped R, L, C components. We adapt a distributed transmission line model to address such issues and possibly improve the reliability in the intra-nodes communication. Furthermore, based on the bandwidth requirements of each sensor node, the large-scaled senor network is proposed to be transformed into a maze diagram by a user defined threshold bandwidth, so that many existing approaches may be applied to determine the routing paths in the inter-nodes communication to improve the efficiency of the overall network.
Keywords
pattern clustering; system-on-chip; telecommunication network routing; wireless sensor networks; communication issues; distributed sensor nodes; distributed transmission line model; intra-nodes communication reliability; routing paths; signal propagation; systems-on-chips clustering; wireless sensor network; Application software; Bandwidth; Frequency; Routing; Sensor phenomena and characterization; Sensor systems; Sensor systems and applications; Temperature sensors; Transmission lines; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Embedded and Ubiquitous Computing, 2008. EUC '08. IEEE/IFIP International Conference on
Conference_Location
Shanghai
Print_ISBN
978-0-7695-3492-3
Type
conf
DOI
10.1109/EUC.2008.184
Filename
4755283
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