• DocumentCode
    2410793
  • Title

    Communications via Systems-on-Chips Clustering in Large-Scaled Sensor Networks

  • Author

    Fan, Sharon ; Fan, Jeffrey ; Makki, Kia ; Pissinou, Nikki

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Int. Univ., Miami, FL
  • Volume
    2
  • fYear
    2008
  • fDate
    17-20 Dec. 2008
  • Firstpage
    549
  • Lastpage
    552
  • Abstract
    In this paper, we have proposed a framework of systems-on-chips clustering in application to complicated sensor networks. The framework can be applied to address the communication issues in distributed and large-scaled sensor nodes in wireless sensor network application. There are two communication categories under consideration, i.e. intra-nodes and inter-nodes. Due to the potentially higher frequency in the signal propagation within the sensor node, the characteristics of the interconnect among various systems-on-chips cannot be described in the traditionally lumped R, L, C components. We adapt a distributed transmission line model to address such issues and possibly improve the reliability in the intra-nodes communication. Furthermore, based on the bandwidth requirements of each sensor node, the large-scaled senor network is proposed to be transformed into a maze diagram by a user defined threshold bandwidth, so that many existing approaches may be applied to determine the routing paths in the inter-nodes communication to improve the efficiency of the overall network.
  • Keywords
    pattern clustering; system-on-chip; telecommunication network routing; wireless sensor networks; communication issues; distributed sensor nodes; distributed transmission line model; intra-nodes communication reliability; routing paths; signal propagation; systems-on-chips clustering; wireless sensor network; Application software; Bandwidth; Frequency; Routing; Sensor phenomena and characterization; Sensor systems; Sensor systems and applications; Temperature sensors; Transmission lines; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Embedded and Ubiquitous Computing, 2008. EUC '08. IEEE/IFIP International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3492-3
  • Type

    conf

  • DOI
    10.1109/EUC.2008.184
  • Filename
    4755283