DocumentCode :
2411432
Title :
Lead-free soldering of telecommunication network infrastructure products
Author :
Eriksson, Brian ; Trankell, R.
Author_Institution :
Ericsson AB, Stockholm, Sweden
fYear :
2009
fDate :
18-20 May 2009
Firstpage :
1
Lastpage :
7
Abstract :
Ericsson has successfully transferred to lead-free solder for its high volume telecom network infrastructure products. By implementing measures for lead-free soldering in all stages of the product development process, from design and component selection to the production process, reliable products are ensured. As the high volume consumer electronic products are driving the components market towards lead-free soldering, the availability of components and materials are better for lead-free than for leaded soldering. Components can be obtained from approved sources, which is the basis for quality assurance and reduces the potential problems with counterfeit components. Lead-free conversion has also reduced the number of Last Time Buy (LTB) cases affecting Ericsson.
Keywords :
consumer electronics; design for environment; product development; quality control; soldering; telecommunication industry; Ericsson; consumer electronic products; design for environment; last-time-buy; lead free soldering; product development process; quality assurance; telecommunication network infrastructure products; Availability; Consumer electronics; Environmentally friendly manufacturing techniques; Lead; Process design; Product development; Production; Quality assurance; Soldering; Telecommunication network reliability; Design for Environment; lead-free; soldering; telecommunication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sustainable Systems and Technology, 2009. ISSST '09. IEEE International Symposium on
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-4324-6
Type :
conf
DOI :
10.1109/ISSST.2009.5156736
Filename :
5156736
Link To Document :
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