• DocumentCode
    2411457
  • Title

    Foreword

  • Author

    Young, Chadwin

  • fYear
    2010
  • fDate
    17-21 Oct. 2010
  • Abstract
    The final report of the 2010 International Integrated Reliability Workshop represents the final product of the many authors and volunteers who made this year´s meeting a great success. Since it began in 1982 as the Wafer Level Reliability Workshop, the meeting has maintained a character very different from most other scientific and technical meetings.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International
  • Conference_Location
    S. Lake Tahoe, CA, USA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4244-8521-5
  • Type

    conf

  • DOI
    10.1109/IIRW.2010.5706470
  • Filename
    5706470
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2411457