• DocumentCode
    2412115
  • Title

    SRAM cell reliability degradations due to cell crosstalk

  • Author

    Bae, Jongsun ; Baeg, Sanghyeon ; Wen, ShiJie ; Wong, Rick

  • Author_Institution
    Hanyang Univ. at Ansan, Ansan, South Korea
  • fYear
    2010
  • fDate
    17-21 Oct. 2010
  • Firstpage
    129
  • Lastpage
    132
  • Abstract
    The capacitance between adjacent SRAM cells due to defectivity can increase in smaller geometry technologies. However, the abnormal behaviors due to such defective capacitance in SRAM are often neglected and can cause NTF (No Trouble Found) failures. The effective testing or calibration methods for such capacitance due to defects are not easily available in today´s manufacturing. In this paper, a 3-D field solver was used to see the potential ranges of the defective capacitance. The crosstalk AC current through the coupling capacitance, which is referred to as cell coupling capacitor (CCCP) is newly modeled as a current source to build modified SNM (Static Noise Margin). The two metrics, SNM and VDDMIN show that the reliability under the CCCP can be significantly degraded during memory operations. Even with a marginal CCCP, SNM variation is 40mV at a read operation and VDDMIN shift is 110mV at a write operation in a 65nm SRAM cell.
  • Keywords
    SRAM chips; capacitors; reliability; 3D field solver; SRAM cell reliability degradation; cell coupling capacitor; cell crosstalk; crosstalk AC current; defective capacitance; no trouble found failures; size 65 nm; static noise margin; voltage 110 mV; voltage 40 mV; Capacitance; Capacitors; Couplings; Crosstalk; Integrated circuit modeling; Random access memory; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International
  • Conference_Location
    Stanford Sierra, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4244-8521-5
  • Type

    conf

  • DOI
    10.1109/IIRW.2010.5706505
  • Filename
    5706505