DocumentCode
2412115
Title
SRAM cell reliability degradations due to cell crosstalk
Author
Bae, Jongsun ; Baeg, Sanghyeon ; Wen, ShiJie ; Wong, Rick
Author_Institution
Hanyang Univ. at Ansan, Ansan, South Korea
fYear
2010
fDate
17-21 Oct. 2010
Firstpage
129
Lastpage
132
Abstract
The capacitance between adjacent SRAM cells due to defectivity can increase in smaller geometry technologies. However, the abnormal behaviors due to such defective capacitance in SRAM are often neglected and can cause NTF (No Trouble Found) failures. The effective testing or calibration methods for such capacitance due to defects are not easily available in today´s manufacturing. In this paper, a 3-D field solver was used to see the potential ranges of the defective capacitance. The crosstalk AC current through the coupling capacitance, which is referred to as cell coupling capacitor (CCCP) is newly modeled as a current source to build modified SNM (Static Noise Margin). The two metrics, SNM and VDDMIN show that the reliability under the CCCP can be significantly degraded during memory operations. Even with a marginal CCCP, SNM variation is 40mV at a read operation and VDDMIN shift is 110mV at a write operation in a 65nm SRAM cell.
Keywords
SRAM chips; capacitors; reliability; 3D field solver; SRAM cell reliability degradation; cell coupling capacitor; cell crosstalk; crosstalk AC current; defective capacitance; no trouble found failures; size 65 nm; static noise margin; voltage 110 mV; voltage 40 mV; Capacitance; Capacitors; Couplings; Crosstalk; Integrated circuit modeling; Random access memory; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International
Conference_Location
Stanford Sierra, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-8521-5
Type
conf
DOI
10.1109/IIRW.2010.5706505
Filename
5706505
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