• DocumentCode
    2412198
  • Title

    Insights about reliability of Heterojunction Bipolar Transistor under DC stress

  • Author

    Cacho, F. ; Ighilahriz, S. ; Diop, M. ; Roy, D. ; Huard, V.

  • Author_Institution
    STMicroelectronics, Crolles, France
  • fYear
    2010
  • fDate
    17-21 Oct. 2010
  • Firstpage
    139
  • Lastpage
    141
  • Abstract
    250GHz SiGe(C) Heterojunction Bipolar Transistor (HBT) is a high performance device with low noise figure and high transconductance particularly required in power RF circuits. Applications are various: 77GHz automotive radars, non invasive imaging in airport for example. In order to achieve such specification, aggressive design leads to use of HBT at high collector current and sometime with VCE bias higher than collector emitter breakdown voltage with open base BVCEo. This last bias condition is known to induce progressive degradation with time and must be taken into account in Design-in-Reliability model. While reverse mode has been widely investigated, reliability of direct mode biased HBT is a new research field. It has been recently investigated, the underlying damage physics is now identified, the integrity of EB and BC junctions is known to be impacted as illustrated in the simulation of Fig. 1. The present paper aims at presenting a methodology for characterizing the aging of HBT in time and translating the parameters change of its model card.
  • Keywords
    Ge-Si alloys; heterojunction bipolar transistors; millimetre wave transistors; semiconductor device models; semiconductor device reliability; DC stress; SiGe; automotive radars; collector emitter breakdown voltage; design-in-reliability model; frequency 250 GHz; heterojunction bipolar transistor; millimetre wave transistors; non-invasive imaging; semiconductor device reliability; Degradation; Heterojunction bipolar transistors; Integrated circuits; Mathematical model; Noise; Stress; Stress measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International
  • Conference_Location
    Fallen Leaf, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4244-8521-5
  • Type

    conf

  • DOI
    10.1109/IIRW.2010.5706508
  • Filename
    5706508