DocumentCode
241320
Title
Technologies for integrated mm-Wave antennas
Author
Brebels, S. ; Enayati, A. ; Soens, C. ; De Raedt, W. ; Van der Perre, Liesbet ; Vandenbosch, Guy A. E.
Author_Institution
IMEC, SSET, Leuven, Belgium
fYear
2014
fDate
6-11 April 2014
Firstpage
727
Lastpage
731
Abstract
High datarate applications are possible by exploiting the large bandwidth offered at mm-wave frequencies. Realization of antenna modules is however not trivial at these high frequencies due to the increased material losses and higher sensitivity to manufacturing tolerances. In this paper, we study the suitability of three packaging technologies (organic, LTCC and thin-film) for the integration of 60 GHz active phased array modules. Both the antenna and interconnect performance is investigated.
Keywords
millimetre wave antennas; radio networks; LTCC; antenna modules; datarate applications; integrated mm-Wave antennas; manufacturing tolerances; mm-wave frequencies; organic; packaging technologies; phased array modules; thin-film; Antenna measurements; Arrays; Microstrip; Microstrip antennas; Silicon; Substrates; Antenna package; LTCC; millimeter wave antennas; organic substrate; thin-film; unlicensed 60 GHz band;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (EuCAP), 2014 8th European Conference on
Conference_Location
The Hague
Type
conf
DOI
10.1109/EuCAP.2014.6901862
Filename
6901862
Link To Document