Title :
Technologies for integrated mm-Wave antennas
Author :
Brebels, S. ; Enayati, A. ; Soens, C. ; De Raedt, W. ; Van der Perre, Liesbet ; Vandenbosch, Guy A. E.
Author_Institution :
IMEC, SSET, Leuven, Belgium
Abstract :
High datarate applications are possible by exploiting the large bandwidth offered at mm-wave frequencies. Realization of antenna modules is however not trivial at these high frequencies due to the increased material losses and higher sensitivity to manufacturing tolerances. In this paper, we study the suitability of three packaging technologies (organic, LTCC and thin-film) for the integration of 60 GHz active phased array modules. Both the antenna and interconnect performance is investigated.
Keywords :
millimetre wave antennas; radio networks; LTCC; antenna modules; datarate applications; integrated mm-Wave antennas; manufacturing tolerances; mm-wave frequencies; organic; packaging technologies; phased array modules; thin-film; Antenna measurements; Arrays; Microstrip; Microstrip antennas; Silicon; Substrates; Antenna package; LTCC; millimeter wave antennas; organic substrate; thin-film; unlicensed 60 GHz band;
Conference_Titel :
Antennas and Propagation (EuCAP), 2014 8th European Conference on
Conference_Location :
The Hague
DOI :
10.1109/EuCAP.2014.6901862
