• DocumentCode
    2413255
  • Title

    Fabrication and modeling of optical interconnects using selective area growth metalorganic chemical vapor deposition

  • Author

    Alam, M.A. ; People, R. ; Sputz, S.K. ; Hybertsen, M.S. ; Isaacs, E. ; Evans-Lutterodt, K. ; Vandenberg, J. ; Siegrist, T. ; Pernell, T.L. ; Lang, D.V. ; Chu, S.N.G. ; Johnson, J.E. ; Ketelsen, L.

  • Author_Institution
    AT&T Bell Labs., Murray Hill, NJ, USA
  • fYear
    1998
  • fDate
    4-8 Oct. 1998
  • Firstpage
    197
  • Lastpage
    198
  • Abstract
    A computational model for selective area growth has been verified using a comprehensive suite of experimental measurements: atomic force microscopy, optical interference microscopy, microphotoluminescence, and micro-Xray diffraction. The model then allows for constructive engineering of the material thickness and composition through manipulation of the oxide mask used in selective area growth. This can be a fundamental input to the design of optical interconnects and integrated photonic devices.
  • Keywords
    MOCVD; X-ray diffraction; atomic force microscopy; integrated optics; integrated optoelectronics; light interference; optical fabrication; optical interconnections; optical microscopy; photoluminescence; atomic force microscopy; composition; computational model; constructive engineering; design; fabrication; integrated photonic devices; material thickness; micro-X-ray diffraction; microphotoluminescence; optical interconnects; optical interference microscopy; oxide mask; selective area growth; selective area growth metalorganic chemical vapor deposition; Area measurement; Atom optics; Atomic force microscopy; Atomic measurements; Computational modeling; Force measurement; Optical computing; Optical device fabrication; Optical interconnections; Optical microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Laser Conference, 1998. ISLC 1998 NARA. 1998 IEEE 16th International
  • Conference_Location
    Nara, Japan
  • ISSN
    0899-9406
  • Print_ISBN
    0-7803-4223-2
  • Type

    conf

  • DOI
    10.1109/ISLC.1998.734204
  • Filename
    734204