Title :
Multi-functional Monolithic-MEMS Tactile Imager Using Flexible Deformation of Silicon IC
Author :
Takao, Hidekuni ; Yawata, Masaki ; Kodama, Ryo ; Sawada, Kazuaki ; Ishida, Makoto
Author_Institution :
Toyohashi Univ. of Technol., Toyohashi
Abstract :
In this paper, a novel concept of multi-functional MEMS tactile imager using flexible deformation of silicon IC for advanced tactile sensing applications is presented. Integration design of multi-functional tactile imager with sensing abilities of contact-force, hardness and temperature distributions is totally discussed based on their measured performances. This tactile sensor has a sensing region of silicon diaphragm on which two-dimensional (2-D) sensor array and circuits are integrated. Signal processing circuitry for the sensing array is also integrated around the diaphragm. The sensing diaphragm is pneumatically swollen by an air-pressure to obtain a soft and flexible surface of tactile sensor. Contact force distribution of touching object can be detected from stress distribution on the deformed diaphragm. Also, hardness distribution can be detected by ´amplitude-modulation´ of the diaphragm vibration. Surface temperature distribution is measured using temperature sensor array integrated on the same diaphragm. Finally, total device design of multi-functional monolithic tactile imager is discussed considering robustness of sensor structure under practical use.
Keywords :
microsensors; tactile sensors; temperature distribution; temperature measurement; amplitude-modulation; diaphragm vibration; flexible deformation; multifunctional monolithic-MEMS tactile imager; sensing array; signal processing circuitry; silicon IC; silicon diaphragm; stress distribution; surface temperature distribution; tactile sensor; temperature sensor array; Application specific integrated circuits; Integrated circuit measurements; Micromechanical devices; Monolithic integrated circuits; Performance evaluation; Sensor arrays; Silicon; Tactile sensors; Temperature distribution; Two dimensional displays;
Conference_Titel :
Custom Integrated Circuits Conference, 2007. CICC '07. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-1623-3
Electronic_ISBN :
978-1-4244-1623-3
DOI :
10.1109/CICC.2007.4405697