Title :
Flip-chip bonded arrays of monolithically integrated, microlensed vertical cavity lasers and resonant photodetectors
Author :
Louderback, D.A. ; Sjolund, O. ; Hegblom, E.R. ; Ko, J. ; Coldren, L.A.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
We present flip-chip bonded arrays of novel, monolithically integrated, microlensed vertical-cavity lasers (VCLs) and resonant photodetectors. The bottom emitting VCLs exhibit ∼300 μA threshold currents, while adjacent detectors have the same operating wavelength and responsivities of ∼0.4 A/W. Only a single epitaxial growth is required.
Keywords :
epitaxial growth; flip-chip devices; integrated optoelectronics; microlenses; photodetectors; semiconductor growth; semiconductor laser arrays; /spl mu/A threshold currents; 300 muA; bottom emitting VCLs; flip-chip bonded semiconductor laser arrays; microlensed vertical cavity lasers; microlensed vertical-cavity lasers; monolithically integrated; operating wavelength; resonant photodetectors; responsivities; single epitaxial growth; Bonding; Detectors; Epitaxial growth; Lenses; Microoptics; Optical arrays; Photodetectors; Resonance; Threshold current; Vertical cavity surface emitting lasers;
Conference_Titel :
Semiconductor Laser Conference, 1998. ISLC 1998 NARA. 1998 IEEE 16th International
Conference_Location :
Nara, Japan
Print_ISBN :
0-7803-4223-2
DOI :
10.1109/ISLC.1998.734225
