Title :
Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems
Author :
Bakir, Muhannad S. ; Dang, Bing ; Meindl, James D.
Author_Institution :
Georgia Inst. of Technol., Atlanta
Abstract :
This paper describes electrical, optical, and fluidic (or ´trimodal´) chip I/O interconnect networks for gigascale systems to meet and exceed end-of-roadmap projections in the areas of power delivery, off-chip bandwidth, and heat removal, respectively. The trimodal I/O technology is proposed to overcome the adverse effects of conventional silicon ancillary technologies on the performance of a gigascale system. We describe trimodal I/O interconnect configurations, fabrication, assembly, and testing.
Keywords :
integrated circuit interconnections; integrated optoelectronics; nanoelectronics; I/O interconnect networks; electrical chip; fluidic chip; heat removal; off-chip bandwidth; optical chip; power delivery; revolutionary nanosilicon ancillary technologies; trimodal chip; ultimate-performance gigascale systems; Bandwidth; Heat sinks; Integrated circuit interconnections; Microprocessors; Optical interconnections; Power system interconnection; Resistance heating; Silicon; System-on-a-chip; Thermal resistance;
Conference_Titel :
Custom Integrated Circuits Conference, 2007. CICC '07. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-1623-3
Electronic_ISBN :
978-1-4244-1623-3
DOI :
10.1109/CICC.2007.4405766
